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Quick Details

  • Other Names: potting epoxies
  • Place of Origin: Taiwan
  • Classification: Double Components Adhesives
  • Main Raw Material: Epoxy
  • Usage: Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking, Electrical and electronic
  • Brand Name: FONG YONG
  • Model Number: E-538-1/H-538-1
  • High temperature resistance: rigid
  • Heat cure: low viscosity

Packaging & Delivery

Packaging Details 5kgs, 15kgs
Delivery Time 7-15 days

Specifications

potting compound epoxy casting adhesive resin for protecting electronic components

 

potting compound epoxy casting adhesive resin for protecting electronic components

 

E-538-1/H-538-1 is two parts epoxy resin systems.  It is designed for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. It could bond a wide variety of substrates, including metals, glass, ceramics and many plastics.

 

Features

  1. Non-porous, water and chemical resistant.
  2. Solvent-free, no attack of solvent sensitive plastics.
  3. Affords high security, once cured, very difficult to remove.
  4. Electrical insulator.
  5. High temperature resistance.
  6. Excellent resistance to water, moisture, oil, grease and numerous chemicals.

 

 

Typical Properties

                                          E-538-1                 H-538-1 

Appearance                              Clear or black liquid      Clear liquid

Specific Gravity (25°C)                        1.1                      0.95

Viscosity (100g, 25°C)                     7,000-9,000               30-50

 

Mixing Information:

Ratio by weight                          5                     1

 

Curing:

Pot life (25°C, 100g)                                20 – 30 minutes

Curing time                                       80°C × 1 hours + 120°C x 1 hours

 

Typical Physical Properties

Hardness                                          85~90 Shore D

Shrinkage                                            0.001~0.003

 

 

How to Use

  1. Prepare dry and clean container and mixer.
  2. Based on the required quantities, mix resin (E-538-1) and hardener (H-538-1) at a ratio of 5:1 by weight. 
  3. Thoroughly mix the resin and hardener (Scrape down mixtures out the container wall, and mix well again).
    1. Vacuum to de-air.
    2. Apply the mixture into the objects. 
    3. Heat cure at a curing oven. 

potting compound epoxy casting adhesive resin for protecting electronic components

 

Description:

E-538-1/H-538-1 is two parts epoxy resin systems.  It is designed for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. It could bond a wide variety of substrates, including metals, glass, ceramics and many plastics.

 

Features

  1. Non-porous, water and chemical resistant.
  2. Solvent-free, no attack of solvent sensitive plastics.
  3. Affords high security, once cured, very difficult to remove.
  4. Electrical insulator.
  5. High temperature resistance.
  6. Excellent resistance to water, moisture, oil, grease and numerous chemicals.
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