potting compound epoxy casting adhesive resin for protecting electronic components

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1 Kilogram/Kilograms (Min. Order)
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Overview
Quick Details
Other Names:
potting epoxies
Place of Origin:
Taiwan
Classification:
Double Components Adhesives
Main Raw Material:
Epoxy
Usage:
Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking, Electrical and electronic
Brand Name:
FONG YONG
Model Number:
E-538-1/H-538-1
High temperature resistance:
rigid
Heat cure:
low viscosity
SupplyAbility
SupplyAbility:
100 Ton/Tons per Month
Packaging & Delivery
Packaging Details
5kgs, 15kgs
Lead Time :
7-15 days

Specifications

potting compound epoxy casting adhesive resin for protecting electronic components

 

potting compound epoxy casting adhesive resin for protecting electronic components

 

E-538-1/H-538-1 is two parts epoxy resin systems.  It is designed for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. It could bond a wide variety of substrates, including metals, glass, ceramics and many plastics.

 

Features

  1. Non-porous, water and chemical resistant.
  2. Solvent-free, no attack of solvent sensitive plastics.
  3. Affords high security, once cured, very difficult to remove.
  4. Electrical insulator.
  5. High temperature resistance.
  6. Excellent resistance to water, moisture, oil, grease and numerous chemicals.

 

 

Typical Properties

                                          E-538-1                 H-538-1 

Appearance                              Clear or black liquid      Clear liquid

Specific Gravity (25°C)                        1.1                      0.95

Viscosity (100g, 25°C)                     7,000-9,000               30-50

 

Mixing Information:

Ratio by weight                          5                     1

 

Curing:

Pot life (25°C, 100g)                                20 – 30 minutes

Curing time                                       80°C × 1 hours + 120°C x 1 hours

 

Typical Physical Properties

Hardness                                          85~90 Shore D

Shrinkage                                            0.001~0.003

 

 

How to Use

  1. Prepare dry and clean container and mixer.
  2. Based on the required quantities, mix resin (E-538-1) and hardener (H-538-1) at a ratio of 5:1 by weight. 
  3. Thoroughly mix the resin and hardener (Scrape down mixtures out the container wall, and mix well again).
    1. Vacuum to de-air.
    2. Apply the mixture into the objects. 
    3. Heat cure at a curing oven. 

potting compound epoxy casting adhesive resin for protecting electronic components

 

Description:

E-538-1/H-538-1 is two parts epoxy resin systems.  It is designed for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. It could bond a wide variety of substrates, including metals, glass, ceramics and many plastics.

 

Features

  1. Non-porous, water and chemical resistant.
  2. Solvent-free, no attack of solvent sensitive plastics.
  3. Affords high security, once cured, very difficult to remove.
  4. Electrical insulator.
  5. High temperature resistance.
  6. Excellent resistance to water, moisture, oil, grease and numerous chemicals.